Invited Speaker 7th Modern Solid Phase Peptide Synthesis & Its Applications Symposium 2019

A new scenario for disulfide peptide synthesis based on 3-nitro-2-pyridinesulfenates (#7)

Yoshio Hayashi 1 , Akihiro Taguchi 1
  1. Tokyo University of Pharmacy and Life Sciences, Hachioji, Tokyo, Japan

Chemistry based on 3-nitro-2-pyridinesulfenyl (Npys) group gave us a new scenario on disulfide peptide synthesis [1]. Two topics will be discussed in the lecture, i.e., new solid- or none-solid-supported 3-nitro-2-pyridinesulfenates (Npys-OR) as disulfide bond-forming agents [2] and solid-phase-assisted disulfide ligation method [3].

The former realizes "on-resin" disulfide bond formation for preparing cyclic peptides in combination with the 2-mercaptoethanol treatment for the deprotection of tBu-thio groups from two Cys residues in SPPS, which can be applied to the automated solid-phase protocol. Moreover, by the combination with iodine oxidation, more complicated disulfide peptides like "α-conotoxin" with four Cys residues can be successfully synthesized on resin.

The latter give us a disulfide peptide from two kinds of Cys-containing peptide fragments in a simple solid-phase assisted procedure by using a “Npys-Cl resin”, which can lead to the syntheses of 1) cyclic peptides via the subsequent intra-molecular amide bond formation and 2) multi-connecting disulfide peptides via the repetitive disulfide ligation. Moreover, this chemistry is useful to construct a variety of disulfide conjugates. One of the typical examples is a conjugation between peptide and drug with a different solubility to the reaction solvent [4]. In the lecture, I will also discuss the development of a stable Npys-Cl surrogate to increase the efficiency of this technology.

  1. Rentier, C., Hayashi, Y., et al., J. Pept. Sci., 23, 496-504 (2017).
  2. Taguchi, A., Hayashi, Y., et al., Chem. Eur. J., 23, 8262-8267 (2017).
  3. Taguchi A., Hayashi, Y., et al., Org. Biomol. Chem., 13, 3186-3189 (2015).
  4. Muguruma, K., Hayashi, Y., et al., Angew. Chem. Int. Ed., 57, 2170-2173 (2018).